1.6T OSFP224 silicon photonic transceivers are the next-generation ultra-high-bandwidth interconnect solution built for hyperscale AI training clusters, large-scale HPC environments, InfiniBand XDR fabrics and 1.6T Ethernet leaf-spine switching networks. Fully compliant with IEEE 802.3dj D1.1, OSFP224 MSA and CMIS 5.2 industry standards, these 1600G optical modules adopt integrated silicon photonics (SiPh) DFB transmitters and PIN receivers, paired with advanced 3nm DSP chips to deliver stable 8×212.5Gbps PAM4 signal transmission, supporting native 1.6T Ethernet and flexible breakout modes: 2×800G, 4×400G, 8×200G dual-port high-density optical links.

We offer a complete full-reach product portfolio covering short-medium-long-ultra-long single-mode fiber transmission, including DR8, FR8, LR8, ER8 and ZR8 variants, equipped with dual MPO-12 APC and duplex LC connector options. Two thermal designs are available: finned integrated heat sink (IHS) for standard air-cooled switches and flat-top low-profile heat sink for compact DGX GPU chassis. All modules feature built-in DDM/DOM real-time digital diagnostic monitoring, maximum 30W power consumption, seamless plug-and-play compatibility with NVIDIA/Mellanox Spectrum-X series switches, DGX GPU servers, Arista, Cisco, Juniper and whitebox switching platforms. Silicon photonics architecture greatly improves integration density, reduces overall power loss and lowers mass deployment cost, perfectly solving bandwidth bottlenecks for trillion-parameter LLM training, low-latency GPU pooling and inter-data-center long-distance optical transmission.

1.Advanced Silicon Photonics (SiPh) Core Design
Integrated SiPh DFB laser & PIN photodiode, high chip integration, low power consumption, excellent cost scalability for mass AI cluster deployment, superior linear PAM4 signal performance vs traditional discrete optical devices.

2.3nm High-Performance DSP Chip
Onboard 3nm DSP signal processing engine, optimizes signal integrity for 212.5Gbps per lane, ultra-low bit error rate, stable long-distance transmission under high-load AI computing scenarios.

Complete transmission range from 500m rack-to-rack to 120km metro DCI: DR8 (500m), FR8 (2km), LR8 (10km), ER8 (40km), ZR8 (120km), covering intra-cluster, leaf-spine uplink, campus backbone and cross-data-center interconnection.

4. Dual Thermal Heat Sink Options
Finned IHS version for standard air-cooled switch slots; flat-top closed heat sink variant for compact DGX GPU cabinet space-limited deployment, efficient thermal dissipation under max 30W power draw.

5.Multi-Platform Native Compatibility
Plug-and-play compatible with NVIDIA InfiniBand XDR systems, Spectrum-X800 switches, DGX H100/H200 GPU clusters, mainstream enterprise/cloud switches including Arista, Cisco, Juniper and generic whitebox hardware.

6.Comprehensive Standard Compliance & Reliable Monitoring
Conform to IEEE 802.3dj, OSFP224 MSA, CMIS 5.2 and RoHS standards; built-in DDM/DOM monitoring to track real-time module temperature, supply voltage, TX/RX optical power for predictive maintenance.

7.Complete After-Sales Support Policy
30-day free return, 1-year free replacement, 3-year official warranty, lifetime dedicated technical support for bulk hyperscale and HPC customers.

Parallel Single-Mode Short-Medium Reach (1310nm, Dual MPO-12 APC)
1.OSFP224-1.6T-DR8: 1310nm, 500m G.652 SMF, dual MPO-12 APC, finned heat sink, SiPh DFB/PIN, PAM4, DDM
2.OSFP224-1.6T-DR8-FLT: Flat-top low-profile heat sink for DGX GPU chassis, 500m, dual MPO-12 APC, SiPh silicon photonic

CWDM Medium-Long Reach (1271/1291/1311/1331nm, Duplex LC UPC)
3.OSFP224-1.6T-FR8: CWDM 4-lambda, 2km G.652 SMF, dual duplex LC, SiPh, PAM4, DDM
4.OSFP224-1.6T-LR8: CWDM 4-lambda, 10km G.652 SMF, dual duplex LC, SiPh, PAM4, DDM

Ultra-Long-Haul Single-Mode (1310/1550nm EML SiPh)
5.OSFP224-1.6T-ER8: 1310nm EML silicon photonics, 40km G.652 SMF, duplex LC, DDM
6.OSFP224-1.6T-ZR8: 1550nm coherent-lite SiPh, 120km G.652 SMF, duplex LC, DDM

1. Hyperscale AI GPU & LLM Training Clusters
DGX H100/H200 GPU interconnection, trillion-parameter large model training, low-latency GPU pooling, 1.6T leaf-spine 102.4T switching fabric uplink.
2. InfiniBand XDR High Performance Computing
Supercomputer parallel computing networks, XDR InfiniBand fabric, high-throughput scientific computing cluster optical links.
3. Hyperscale Cloud & Colocation Data Center
1.6T Ethernet core switching, breakout 2×800G downlink aggregation, high-density rack-to-rack interconnection.
4.Enterprise & Carrier Metro DCI Networks
Data center interconnection (DCI), enterprise core backbone uplink, cross-campus long-distance optical transmission, metro carrier transport links.

Parameter	Standard Specification
Total Aggregate Bandwidth	1600Gbps (8×212.5Gbps PAM4)
Electrical Interface	8×212.5Gbps PAM4, 1.6T AUI-8 / 2×800GAUI-4
Optical Breakout Mode	1×1.6T / 2×800G / 4×400G / 8×200G
Modulation Format	PAM4, 106.25GBaud
Optical Chip Architecture	Silicon Photonics (SiPh) DFB Transmitter + PIN Receiver
DSP Chip	3nm High-Speed Signal Processing DSP
Compliance Standards	IEEE 802.3dj D1.1, OSFP224 MSA, CMIS Rev 5.2, RoHS
Digital Monitoring	DDM / DOM Real-Time Diagnostic Monitoring
Max Power Consumption	≤30W
Operating Temperature	Commercial Grade 0℃ ~ +70℃ (32℉ ~ 158℉)
Supported Fiber	G.652D / G.657A Single-Mode Fiber (SMF)
Connector Options	Dual MPO-12 APC, Dual Duplex LC UPC
Thermal Solutions	Finned Integrated Heat Sink (IHS) / Flat-Top Low-Profile Heat Sink
Supported Protocols	1.6T Ethernet, InfiniBand XDR
Hardware Compatibility	NVIDIA Spectrum Switches, DGX GPU Servers, Arista, Cisco, Juniper, Whitebox Switches

Looking for cost-effective 1.6T OSFP224 silicon photonic transceivers for your AI GPU cluster or InfiniBand XDR HPC network? Our full-reach DR8/FR8/LR8/ER8/ZR8 1600G optical modules support all mainstream switch and GPU platforms, with stable global stock, custom private labeling and volume order discounts available. Contact our sales team to download official datasheets, request engineering samples and get bulk pricing for silicon photonic 1.6T OSFP224 transceivers.